In-situ measurements of Stress during electrodeposition of copper nanofilms : Effect of growth rate and additives

Murphy, Joe A. and Lenihan, Catherine and Rybalchenko, Maria and Quill, Nathan and Bourke, Andrea and O'Grady, Michael and Lynch, Robert P. and Buckley, D. Noel (2018) In-situ measurements of Stress during electrodeposition of copper nanofilms : Effect of growth rate and additives. In: ECS Transactions :. ECS Transactions (13). Electrochemical Society Inc., USA, pp. 1071-1086. ISBN 9781510866171

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Abstract

Stress was measured in situ during electrodeposition of copper nanofilms. Grain size was measured using both in-situ AFM and exsitu SEM imaging and showed that grain size increased with time for about the first 10 depositions and thereafter became approximately constant. Films deposited at low growth rates had compressive stress while films deposited at higher growth rates had tensile stress. The transition from compressive to tensile stress occurred at a growth rate of-1 nm s-1, in reasonable agreement with the literature. Our data supports Chason's model for stress development during thin film deposition. Addition of chloride gives decreased stress, a rougher surface and larger grains. Addition of PEG alone has very little effect on the stress in the deposit. The reduction in stress due to chloride is still observed when PEG is also added and this greatly reduces the surface roughness which occurs with the addition of chloride alone.

Item Type:	Book Section
Additional Information:	Publisher Copyright: ©The Electrochemical Society.
Uncontrolled Keywords:	/dk/atira/pure/subjectarea/asjc/2200
Departments or Groups:
Depositing User:	Admin SSL
Date Deposited:	19 Oct 2022 23:15
Last Modified:	07 Jun 2023 18:38
URI:	http://repository-testing.wit.ie/id/eprint/4901

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